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FDSOI Grabs European Money for IoT

LONDON--Globalfoundries and STMicroelectronics are the leading chip companies in a European Commission collaborative research project that aims to create an ultra low-power platform for Internet of Things applications based on 22nm FDSOI chip manufacturing process.

The three-year project|s title is "Ultra-low power technologies and memory architectures for IoT." It is otherwise known as Prime and led by Belgian research institute IMEC. Prime includes academic and commercial participants from across the chip-manufacturing ecosystem ¨C from materials and equipment providers to IP core developers ¨C and an aggregate budget of €38.85 million (about $43 million). The European Union will contribute about €12.2 million (about $13.6 million) to the project funding.

The project is set to run until March 31, 2019 and over the three years is chartered with developing and demonstrating the building blocks for ultra-low power IoT systems for medical, agricultural, smarthome and security applications.

The plan is to develop low-power logic, analog, RF and embedded memory circuits for implementation on the 22nm FDSOI manufacturing process together with chip design and system architecture innovations. The embedded memory circuit options are spin-torque transfer magnetic RAM (STT-RAM) and resistive RAM. The specific flavor of ReRAM is not disclosed so far.

Commercial participants in the project include Globalfoundries, STMicroelectronics, Soitec SA, Singulus Technologies AG Zentrum Mikroelektronik Dresden AG, Surecore Ltd. and Intrinsic ID BV. Globalfoundries in Dresden is set to receive a €2.9 million (about $3.3 million) contribution from the European Union while STMicroelectronics is set to receive about €520,000 (about $580,000).

This article was originally published by EE Times Europe

¡ªPeter Clarke covers business news and analog for EE Times Europe.

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