MH278 includes the following on a single silicon chip: voltage regulator, Hall voltage generator, small-signal amplifier, chopper stabilization, Schmitt trigger, and pull up resistor integrated on chip. Advanced DMOS wafer fabrication processing is used to take advantage of low-voltage requirements, component matching, very low input-offset errors, and small component geometries.
This device requires the presence of omni-polar magnetic fields for operation.
MH278 is rated for operation between the ambient temperatures -40℃ and +85℃ for the E temperature range. and -40℃ to +125℃ for the K temperature range. The two package styles available provide magnetically optimized solutions for most applications. Package types SO is a SOT-23, a miniature low-profile surface-mount package, while package UA is a three-lead ultra-mini SIP for through-hole mounting.
The package type is in a Halogen Free version was verified by third party Lab.
